Besi
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The Besi / Datacon Fico Compact Line is a trim and form machine. The model designation presented for the equipment is Fico Compact Line.[1]
Trim and form equipment generally handles packaged devices after encapsulation and cure. Trim and form equipment uses dedicated tooling to cut tie bars or excess metal and to bend leads into the required final shape while maintaining package-to-lead alignment.
Trim and form machines operate in semiconductor assembly rather than wafer fabrication. Trim and form machines are used after die attach, wire bonding, molding, and related package completion steps, and before final inspection, marking, packing, or test flows that require finished lead geometry.
Trim and form equipment is used for leadframe-based semiconductor packages that require metal lead trimming and external lead shaping. Trim and form equipment supports packaged integrated circuits and discrete semiconductor devices where the package leaves the assembly flow with attached leadframe metal that must be cut and formed.
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The following facts about the Fico Compact Line Trim & Form are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Fico Compact Line Trim & Form are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Fico Compact Line Trim & Form are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Fico Compact Line Trim & Form are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Fico Compact Line Trim & Form are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Fico Compact Line Trim & Form is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 17, 2026.
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