Waferpedia

Tokyo Electron

Unity Me

Etch100mmTokyo Electron Unity Me family
Research Quality: 30% complete
Tokyo Electron logo
Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

What is it?

The TEL Unity Me system is described as an automatic plasma etching production tool from Tokyo Electron. At CMi, the available configuration includes the C1 cassette loader for 100mm wafers, one transfer chamber, and the DRM (Dipole Ring Magnet) chamber, which is dedicated to dielectric etching such as SiO2 and SixNy.

What can it run?

Process applications and technology nodes documented for this tool.

  • Dielectric etching
  • SiO2 etching
  • SixNy etching

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • The TEL etcher must not be exposed to metallics or traces of metallics.
  • Wafers previously in contact with metallic layers, including buried layers, must not be loaded.
  • Wafers processed in the SPTS APS etcher are not allowed in the TEL Unity etcher.

What do the numbers mean?

Wafer handling2

Configured wafer size
100mm[1]
Accurate?
Available cassette loader
C1 for 100mm wafers[1]
Accurate?

Configuration & options5

Equipment type
Automatic plasma etching production tool[1]
Accurate?
OEM
Tokyo Electron (TEL)[1]
Accurate?
Process chamber
DRM (Dipole Ring Magnet) chamber[1]
Accurate?
DRM chamber type
RIE chamber with assistance of a magnetic field[1]
Accurate?
Optimized application
Etching dielectrics such as SiO2 and SixNy[1]
Accurate?
Interested in this tool?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What type of etching system is the Tokyo Electron Unity Me?

It is an automatic plasma etching production tool. Its DRM chamber is a reactive ion etching chamber with magnetic-field assistance.[1]

What wafer size does the available configuration handle?

The available configuration is for 100 mm wafers.[1]

Which process chamber is available in the CMi configuration?

The available process module is P1 with the DRM chamber.[1]

Not publicly documented

The following facts about the Unity Me are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Unity Me are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Unity Me are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Unity Me are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the Unity Me is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Unity Me are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.chepfl.ch
  2. [2]Tactras | Tokyo Electrontel.com (Feb 3, 2012)web.archive.org
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Last updated Jul 29, 2026.

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