Karl Suss

Plate 01Karl Suss MA4 Mask Aligner #59229
A mask aligner transfers a pattern from a photomask to a photoresist-coated substrate by bringing the mask and wafer into close alignment and exposing the resist to patterned ultraviolet light. In contact mode the mask and substrate are placed together during exposure, while in proximity mode a small separation is maintained to reduce direct contact.
This class of tool sits in the front end of a lithography sequence, after substrate preparation and photoresist coating and before development and later pattern transfer steps. It is used to register the mask to the substrate and expose the resist so that the latent image can be developed into a patterned resist layer.
The MA-4 is used for photolithography on small substrates and is suited to patterning work that benefits from backside alignment. Its described use with positive and negative photoresists indicates applicability to a range of resist-based patterning flows.[1]
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It is used with substrates up to four inches in diameter and also works with smaller samples.[1][2]
It can be set to use either 365 nm or 405 nm light.[1]
Yes. It offers real-time infrared through-wafer backside alignment.[1][2]
It is used with a variety of both positive and negative photoresists.[1]
The following facts about the MA-4 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA-4 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA-4 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA-4 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA-4 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA-4 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Jul 29, 2026.
ASML PAS 5500/300 is a deep-UV stepper photolithography tool configured for 4-inch wafers.
The GCA 6100 C Wafer Stepper is a lithography tool for 100 mm wafers with a 150 mm X/Y stage travel and an AWH1 automatic wafer handler.
The OAI 808 Aligner is a semi-automated, four-camera, optical front- and backside mask aligner with stated alignment accuracy of 1µm to 2µm.
The OAI Model 800 Mask Aligner is a semi-automated, four-camera, optical front- and backside mask aligner with motorized backside focus, motorized auto leveling, and auto gap setting.