Fab Operation
Labs, QA, characterization
Failure-analysis and metrology labs: cross-sectioning, imaging, electrical fault isolation, and materials characterization.
Metrology & Inspection
Optical first, SEM second — most labs pair the two
The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.
Test & Probe
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The ESPEC 212M is an environmental test chamber model documented in two user manuals on MetrologyManuals.
The Rasco SO 2000 Handler is a dual-temp tube-to-tube handler for SSOP 8 and 16 packages with 4 sites.
Wet Processing / Clean
Tokyo Electron Clean Track Act 8 is a DUV clean track system for 8-inch wafers.
The Semitool 270 S L SRD is an automated spin rinse dryer used in semiconductor wafer processing.
ASML SERV.470.54502 is a sealed cleanroom part designated as an OIU Trackball Assembly.
The SCREEN / DNS 80 EX Wafer Scrubber is a wafer scrubber with 4 cleaning units, brush cleaning, and CO2 high-pressure washing.
Dicing & Grinding
Cross-section prep pairs polishing with the imaging queue
The Buehler Isomet 4000 is a precision linear sectioning saw.
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.
The Accretech ACS 100 A is a cleaning after dicer system used in semiconductor dicing and grinding operations.
The Disco DAD 3350 is an automatic dicing saw.
Precision Optics
The Wyko HD8000 is a non-contact optical profiler for magnetic thin-film heads that measures pole-tip recession or ABS flatness in less than 3 seconds.
The Nikon Z series is a line of mirrorless interchangeable-lens cameras using the Nikon Z-mount with FX and DX sensors.
The Nikon 150 X Objectives is a microscope objective used in optical spectroscopy and nanoribbon characterization.
The Keysight 5517A is a Class II helium-neon laser source providing stable 633 nm wavelength light for precision dual-frequency interferometry.
The Zygo Zegage 3D Optical Surface Profiler is a non-contact optical profiler for measuring surface topography.
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