Equipment coverage

Datacenter and AI Infrastructure Equipment

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Every AI accelerator requires a manufacturing supply chain two steps upstream from the datacenter it will run in. The supply chain runs from fab tooling to component production to hardware assembly to datacenter installation. Most forecasters watch the last two steps. This page covers the first: the equipment that gates AI chip output before a single watt of power is drawn.

The three equipment categories most directly constraining AI accelerator supply are advanced packaging (CoWoS and HBM bonding), optical interconnect fabrication (silicon photonics for co-packaged optics), and power semiconductor process tools (GaN and SiC for datacenter power conversion). A surge in sourcing activity for these categories is among the earliest measurable signals that datacenter capacity is forming.

Equipment categories

Advanced Packaging and CoWoSThermocompression bonders, mass reflow systems, flip-chip tools, and wafer-level packaging equipment for CoWoS and fan-out packaging. These tools gate AI accelerator production capacity.EtchDeep silicon etch for through-silicon vias (TSVs) in HBM and 3D NAND stacking. Plasma etch for photonic structure patterning in silicon photonics.DepositionALD for TSV barrier and seed layers, PECVD for silicon nitride waveguides, and MOCVD for GaN and SiC power semiconductor epitaxy.CMPChemical mechanical planarization for TSV reveal and interlayer dielectric planarization in HBM fabrication.Test and ProbeHigh-speed ATE for HBM characterization and AI SOC testing. Teradyne UltraFLEX and Advantest T2000 platforms are central to AI chip test.Metrology and InspectionOverlay metrology and defect inspection for advanced packaging layers. Critical for yield in CoWoS and heterogeneous integration.

Plan a datacenter-supply fab

The Build tool lets you pick an operation type (advanced packaging, silicon photonics, power semiconductors) and generate a full equipment plan from cited catalog entries, with budget tiers and phase timelines.

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Key OEMs in AI infrastructure

ASMLEUV and DUV lithographyApplied MaterialsCVD, ALD, CMP, etchLam ResearchEtch, ALD, CVDTokyo ElectronEtch, CVD, coater/developerKLAMetrology and inspectionBESIDie bonding and packagingKulicke and SoffaBall bonding, TCBASM Pacific TechnologyAdvanced packagingTeradyneATE for HBM and SOC testAdvantestMemory and logic ATEAixtronGaN and SiC MOCVDVeecoGaN MOCVD, MBE