Siplace D 4 Placement

A placement machine in SMT assembly picks electronic components from feeders or trays and places them onto prepared circuit boards. Placement machines are used after solder paste deposition and before solder reflow. Placement machines are part of electronics assembly rather than wafer fabrication.

A placement machine uses motion systems, vision alignment, and placement heads to move components from component supply positions to programmed board locations. A placement machine typically verifies board and component position, corrects for offset and rotation, and places parts onto solder paste or adhesive with controlled force. A placement machine generally operates from placement programs that define component libraries, feeder assignments, and board coordinates.

A placement machine fits into the SMT line after bare boards have received solder paste through stencil printing. A placement machine is followed by reflow soldering, where the placed components are permanently joined to the board. A placement machine may also be used in lines that include inspection before or after placement to confirm paste quality, presence, position, and orientation.

Placement machines are used to assemble populated printed circuit boards for electronic products. Placement machines handle surface mount components used in control electronics, communications hardware, computing assemblies, industrial devices, and many other board-level products. Placement machines support repeatable component positioning for both prototype work and volume production, depending on line configuration and tooling.