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EV Group

610

LithographyEV Group 610 family
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The EVG 610 is a compact, multi-purpose R&D mask alignment system. The EVG 610 supports top-side and bottom-side alignment. The EVG 610 handles substrate sizes up to 200 mm.[1][2]

EV Group610
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What it is

The EVG 610 is a mask alignment system. The EVG 610 is a compact multi-purpose R&D system. The EVG 610 can handle small substrate pieces and wafers up to 200 mm. The EVG 610 supports standard lithography processes and offers optional back-side alignment. The EVG 610 also offers bond alignment and nanoimprint lithography capability.[1][4]

How it works

The EVG 610 supports vacuum contact, hard contact, soft contact, and proximity exposure modes. The EVG 610 provides top-side and bottom-side alignment capability. The EVG 610 includes a high-precision alignment stage, automated wedge compensation, and a motorized recipe-controlled exposure gap. The EVG 610 can use either a mercury light source or a UV LED light source.[1]

Applications

General reference — not yet source-verified

Mask aligners are used for patterned resist definition on wafers, chips, and other flat substrates in microfabrication and related device work. Double-sided capability is useful when features on opposite faces must be registered for through-substrate structures, cavity formation, backside patterning, or later bonding steps. Nanoimprint-capable variants extend the same platform toward replicated surface-relief patterning in imprintable materials.

What do the numbers mean?

Vacuum & pumping1

Exposure setup
Vacuum contact / hard contact / soft contact / proximity mode[1]
Accurate?

Wafer handling3

Wafer/substrate size
Up to 200 mm / 8 in[1]
Accurate?
Alignment accuracy
Top side alignment ≤ ±0.5 µm; bottom side alignment ≤ ±2.0 µm; IR alignment ≤ ±2.0 µm depending on substrate material; bond alignment ≤ ±2.0 µm; NIL alignment ≤ ±2.0 µm[1]
Accurate?
Manual-alignment note
The EVG 610 wafer bond aligner manual states that the equipment can align and mount both 4 inch and 6 inch wafers[2]
Accurate?

Optics & imaging4

equipment type
Double-sided Mask Aligner[3]
Accurate?
System type
Mask alignment system[1]
Accurate?
Exposure source
Mercury light source / UV LED light source[1]
Accurate?
Exposure options
Interval exposure / flood exposure / sector exposure[1]
Accurate?

Performance2

Alignment capability
Top-side and bottom-side alignment capability[1]
Accurate?
Additional capabilities
Bond alignment, IR alignment, nanoimprint lithography (NIL)[1]
Accurate?

Control & software4

Wedge compensation
Fully automatic, software controlled[1]
Accurate?
Operating system
Windows[1]
Accurate?
User interface languages
CN, DE, FR, IT, JP, KR[1]
Accurate?
Chamber / recipe environment
Unlimited number of user accounts and recipes[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Exposure setupVacuum contact / hard contact / soft contact / proximity mode[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Which exposure modes does the EVG 610 support?

The EVG 610 supports vacuum contact, hard contact, soft contact, and proximity exposure modes.[1]

Does the EVG 610 support back-side or double-sided alignment?

The EVG 610 supports top-side and bottom-side alignment capability. The EVG 610 mask alignment system also offers the option of back-side alignment.[1][4]

Not publicly documented

The following facts about the 610 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 610 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 610 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 610 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 610 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 610 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]evgroup.com — evgroup.comevgroup.com
  2. [2]epfl.ch — epfl.chepfl.ch
  3. [3]aggiefab.tamu.edu — aggiefab.tamu.eduaggiefab.tamu.edu
  4. [4]EVG®610 — evgroup.comevgroup.com
  5. [5]Baxter Drying Ovens - AggieFab Nanofabrication Facility — aggiefab.tamu.eduaggiefab.tamu.edu
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Last updated Oct 19, 2026.

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