RTX-113

X-ray inspection systems examine the internal structure of assembled parts without cutting them open. X-ray inspection equipment in electronics manufacturing is used to reveal hidden solder joints, internal package features, and buried interconnect details that cannot be checked by ordinary visual inspection.

The Glenbrook RTX-113 uses an X-ray source and an X-ray camera technology to generate high-resolution, high-sensitivity images. The Glenbrook RTX-113 can reveal defects as small as 0.001 inch with a full one inch diameter field of view. The Glenbrook RTX-113 can be activated by foot pedal or by a timer switch. The Glenbrook RTX-113 has a focal spot to image plane distance of 4-6 inches. The Glenbrook RTX-113 has an anode voltage range of 35-52 kV and an anode current of 20-50 microamps with internal adjustment. The Glenbrook RTX-113 has spatial resolution of 20 lp/mm, or up to 100 lp/mm with the MicroTech option.^[2][4][5]

X-ray inspection systems in electronics manufacturing are typically used after assembly steps that create hidden features, such as area-array interconnects or internal board structures. X-ray inspection systems are commonly applied as diagnostic and verification tools between assembly operations and downstream test or failure-analysis work, because they can inspect concealed internal features without destroying the part.

X-ray inspection systems are used where important features are hidden beneath packages, inside laminations, or within enclosed assemblies. X-ray inspection in electronics is especially useful for solder interconnect review, internal package comparison, and investigation of process defects that are not visible from the exterior.