KLA
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The KLA 1501 is a thermocouple instrumented wafer for temperature measurement in semiconductor manufacturing. The KLA 1501 is used for RTP pyrometer calibration. The KLA 1501 was introduced in 1987.[1][2]
The KLA 1501 is a thermocouple instrumented wafer used for temperature measurement and pyrometer calibration in rapid thermal processing systems. The KLA 1501 is also referred to as the Process Probe 1501.[2][1]
The KLA 1501 uses embedded thermocouple sensors in a silicon wafer substrate to measure wafer temperature. The KLA 1501 was introduced in 1987. The KLA 1501 was used by many customers as a reference for temperature calibration in RTP systems. The KLA 1501 design used a thermocouple junction with limited embedding in the wafer, and that structure made the reading sensitive to the temperature of thermocouple wire above the wafer. The KLA 1501 was typically fabricated with from 1 to 34 thermocouple sensors. The KLA 1501 used Type-K or Type-R thermocouple wire. The KLA 1501 used 0.005 inch thermocouple wire. The KLA 1501 used braided silica sleeving or micro quartz tubing for wire insulation. The KLA 1501 wafer substrate was silicon with p-boron doping, (1-0-0) orientation, and minimum thickness of 525 micrometers.[2][1]
The KLA 1501 is used for wafer temperature measurement in the semiconductor industry. The KLA 1501 is used for RTP pyrometer calibration. The KLA 1501 was used in cold wall processing systems, where vertical thermal gradients or heat flux above the wafer could influence measured temperature. The KLA 1501 was sensitive to such conditions, and the temperature offset between the 1501 and the later 1530 in RTP could reach up to 20 degrees Celsius at 1100 degrees Celsius.[2][1]
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The KLA 1501 is a thermocouple instrumented wafer used for wafer temperature measurement and for RTP pyrometer calibration in rapid thermal processing systems.[2][1]
The KLA 1501 uses embedded thermocouple sensors in a silicon wafer substrate. The KLA 1501 typically has from 1 to 34 thermocouple sensors and uses Type-K or Type-R thermocouple wire.[2][1]
The KLA 1501 was replaced by the 1530 because the older 1501 design was more sensitive to the temperature of thermocouple wire above the wafer, which reduced accuracy and repeatability. The 1530 was developed with improved sensor embedding and delivered more than a factor of 4 improvement in wafer to wafer matching and repeatability.[2][1]
A shift in indicated temperature can occur when converting from the 1501 to the 1530. In RTP, an offset of up to 20 degrees Celsius at 1100 degrees Celsius was measured, with the 1530 typically indicating a higher temperature than the 1501 under similar conditions.[2][1]
The following facts about the 1501 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 1501 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1501 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 1501 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 1501 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 1501 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Oct 19, 2026.
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