Lam Research
Alliance 4400
The Lam Research Alliance 4400 is a semiconductor equipment system consisting of a two-chamber set and a controller.[1][2]
What it is
General reference — not yet source-verifiedThe Lam Research Alliance 4400 is an etch tool in semiconductor manufacturing. Etch tools remove selected material from a wafer after pattern definition so later process steps can build device structures.
How it works
General reference — not yet source-verifiedEtch systems of this class process wafers inside vacuum chambers where reactive gas chemistry and plasma are used to remove exposed material. Chamber design, gas delivery, power delivery, pressure control, and wafer handling work together to shape etch rate, selectivity, and profile.
Multi chamber etch platforms of this class commonly separate wafer transfer functions from process chambers so different recipes or chamber conditions can be maintained with reduced cross contamination. Controller subsystems coordinate sequencing, chamber operation, and recipe execution across the tool.
Where it fits in the process flow
General reference — not yet source-verifiedEtch tools are used after a pattern has been formed in photoresist or another masking layer and before later deposition, implantation, clean, strip, or metrology steps. Etch defines features by transferring the mask pattern into underlying films.
Applications
General reference — not yet source-verifiedEtch equipment of this class is used for pattern transfer in integrated circuit and related microfabrication flows. Such tools are applied where film removal must follow a defined mask so conductors, dielectrics, or other patterned layers can be formed.
What do the numbers mean?
Control & software7
Configuration & options6
- Not a complete set (chamber only)[2]
Vintage & configurations
- 1995Vintage[2]
Chamber set noted as 1995 vintage
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How is plasma etching different from purely wet chemical etching?General reference — not yet source-verified
Plasma etching uses reactive species generated in a low pressure discharge and can combine chemical action with directional ion bombardment, which supports profile control and anisotropy. Wet chemical etching relies on liquid chemistry and is often less directional.
Why is selectivity important in an etch process?General reference — not yet source-verified
Selectivity describes how strongly the process removes the target film relative to the mask or an underlying stop layer. High selectivity helps preserve critical dimensions, protect neighboring materials, and stop the process at the intended interface.
What process factors matter most for etch results?General reference — not yet source-verified
Key factors include gas chemistry, plasma conditions, wafer temperature, chamber pressure, mask material, and the composition of the film stack. Together these determine etch rate, uniformity, sidewall shape, residue formation, and susceptibility to surface damage.
Where does etch sit relative to deposition and lithography?General reference — not yet source-verified
Deposition creates the film to be patterned, lithography defines where material should remain or be removed, and etch transfers that pattern into the film. After etch, the wafer typically moves to strip, clean, inspection, or another build step.
Not publicly documented
The following facts about the Alliance 4400 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the Alliance 4400 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Alliance 4400 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Alliance 4400 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Alliance 4400 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Alliance 4400 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
Last updated Oct 16, 2026.
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