Laurell
WS-1000
Laurell WS-1000 Wet Station is a spin-process station. Laurell WS-1000 Wet Station supports coating, etching, developing, cleaning, and rinsing/drying processes. Laurell WS-1000 Wet Station has dimensions of 48" W x 43 3/8" D x 74 1/4" H.[1][2]
What it is
General reference — not yet source-verifiedWet stations provide a contained workspace for chemical handling around coating, developing, cleaning, rinsing, and drying steps. Wet stations used with spin processors are commonly arranged to keep chemical delivery, drainage, exhaust handling, and operator access close to the process area.
How it works
General reference — not yet source-verifiedA wet station of this class supports manual or semi-automated chemical processing by combining a chemical work surface with drainage and exhaust management. A spin-process wet station generally serves as the enclosure around a spin processor so liquid chemicals can be dispensed, developed, rinsed, or dried while splashes and vapors are directed into controlled drain and exhaust paths.
Where it fits in the process flow
General reference — not yet source-verifiedWet stations are used in fab and laboratory flows wherever substrates need open-bowl or deck-level wet processing rather than sealed batch immersion. A spin-process wet station commonly sits around resist coat, develop, solvent clean, aqueous clean, rinse, and dry operations, linking lithography-related wet steps with subsequent inspection, bake, etch, or deposition sequences.
What can it run?
Process applications and technology nodes documented for this tool.
- Coating
- Etching
- Developing
- Cleaning
- Rinsing
- Drying
What do the numbers mean?
Vacuum & pumping4
- Options
- Touch screen control interface; processor exhaust interlock (standard on EDC models); chemical heating; through pressure vessel material stirring (magnetic); rinse to resistivity; drain diverter(s); vacuum loading wand; wafer cassette stand; leak detection; light towers[1]
Gas & chemistry2
- Typical processes
- Coating; etching; developing (aqueous/solvent); cleaning (aqueous/solvent); sulfuric/peroxide (in situ mixing); HBr; temperature-controlled developing; rinsing/drying[1]
- Typical processes
- Coating; Etching; Developing; Aqueous / Solvent Cleaning; Sulfuric / Peroxide (in situ mixing); HBr; Temperature-controlled Developing; Rinsing / Drying[1]
Dimensions & facilities1
Configuration & options14
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| WS-1000-CP7-D | — | — | Flame retardant polypropylene formulation meeting FMRC 4910 testing standards for flame retardation, self-extinguishing characteristics, and burn-through; also stated to meet or exceed standards for low smoke generation and minimal toxic by-products. | web.archive.org[1] |
What replaced it?
Related models
- siblingLaurell WS-1000MH— The page says this model is the mini station and asks whether a larger 4-foot station should be considered instead, linking to WS-1000.source[3]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Typical processesCoating; etching; developing (aqueous/solvent); cleaning (aqueous/solvent); sulfuric/peroxide (in situ mixing); HBr; temperature-controlled developing; rinsing/drying[1]
- Exhaust plenumExhaust plenum with gauge[1]
- Component storageIsolated component/drawer below for heaters, pumps, vessels[1]
- OptionsTouch screen control interface; processor exhaust interlock (standard on EDC models); chemical heating; through pressure vessel material stirring (magnetic); rinse to resistivity; drain diverter(s); vacuum loading wand; wafer cassette stand; leak detection; light towers[1]
- Typical processesCoating; Etching; Developing; Aqueous / Solvent Cleaning; Sulfuric / Peroxide (in situ mixing); HBr; Temperature-controlled Developing; Rinsing / Drying[1]
- ExhaustExhaust plenum with gauge[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What process types does the Laurell WS-1000 support?
The Laurell WS-1000 is intended for coating, etching, developing with aqueous or solvent chemistries, cleaning with aqueous or solvent chemistries, sulfuric and peroxide processing with in situ mixing, HBr processing, temperature-controlled developing, and rinsing and drying.[1][2]
Not publicly documented
The following facts about the WS-1000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the WS-1000 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the WS-1000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the WS-1000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the WS-1000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the WS-1000 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]web.archive.orgweb.archive.org
Last updated Oct 20, 2026.