Nitto
DR 8500 II Wafer Taper
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedWafer tapers are used in wafer preparation within dicing and grinding related operations. Wafer tapers generally apply handling film or tape to a wafer so the wafer can be supported during thinning, singulation, and related back end wafer processes.
How it works
General reference — not yet source-verifiedWafer tapers generally bring a wafer into contact with an adhesive support film under controlled tension and pressure. Wafer tapers generally use alignment, lamination, and bubble reduction steps so the wafer remains supported for later mechanical processing.
Where it fits in the process flow
General reference — not yet source-verifiedWafer taping sits in the back end wafer flow around thinning and singulation preparation. Wafer taping is typically performed before grinding or dicing steps that need the wafer to remain attached to a support medium, and the taped wafer then proceeds to downstream thinning, sawing, or die separation operations.
Applications
General reference — not yet source-verifiedWafer tapers are used for semiconductor wafer handling when the wafer needs temporary mechanical support during back side processing. Wafer tapers are applied in workflows that prepare wafers for thinning, dicing, and other operations where unsupported wafers would be more vulnerable to damage or handling loss.
What do the numbers mean?
Power & electrical1
Wafer handling3
Control & software2
- PLC based system[1]
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Power supply110V[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer thickness range is applicable for the DR 8500 II?
The DR 8500 II is applicable for wafer thicknesses from 300 to 1000 micrometers.[2]
Not publicly documented
The following facts about the DR 8500 II Wafer Taper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DR 8500 II Wafer Taper are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DR 8500 II Wafer Taper are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DR 8500 II Wafer Taper are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DR 8500 II Wafer Taper are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DR 8500 II Wafer Taper is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]wotol.com — wotol.comwotol.com
Last updated Oct 18, 2026.
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