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PR Hoffman

32T

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The PR Hoffman 32T is an insert carrier and lapping carrier model. The PR Hoffman 32T is designated 32T. The PR Hoffman 32T is intended for double-sided planetary lapping and polishing machines and double-sided planetary lapping machines.[1][2][3]

PR Hoffman32T
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What it is

General reference — not yet source-verified

A lapping carrier is a workholding plate used in double-sided planetary finishing equipment. A carrier keeps parts separated in shaped openings while the machine moves the carrier between opposed plates with abrasive slurry or polishing media. An insert carrier uses removable inserts or workhole arrangements to suit the part geometry being processed.

How it works

General reference — not yet source-verified

Double-sided planetary lapping and polishing systems use carriers to transmit motion from the machine drive into a planetary path across the finishing plates. The carrier constrains each workpiece while exposing both faces to simultaneous processing. Carrier design influences part spacing, edge support, media access, and wear behavior during the run.

Where it fits in the process flow

General reference — not yet source-verified

Lapping carriers belong in abrasive finishing flow where flatness, parallelism, thickness control, or surface preparation is required before later cleaning, inspection, polishing, bonding, or assembly. Double-sided planetary processing is typically used after slicing or rough stock preparation and before final surface qualification.

Applications

General reference — not yet source-verified

Carriers of this class are used to process flat parts that benefit from controlled double-sided abrasion or polishing. Typical uses include wafers, disks, seals, optics, ceramics, metals, and other precision components that must be held in repeatable pockets during surface generation or finishing.

  • Insert carriers for double-sided planetary lapping and polishing machines
  • Lapping carriers for double-sided planetary lapping machines

What do the numbers mean?

Wafer handling2

Carrier listing
PR1 / PR2 - PR Hoffman[1]2 sources
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Carrier type
PR1 / PR2[3]
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Configuration & options4

Model designation
32T[1]2 sources
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Intended machine class
Double-Sided Planetary Lapping & Polishing Machines[1]2 sources
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Intended machine class
Double-Sided Planetary Lapping Machines[2]2 sources
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Manufacturer
PR Hoffman[3]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

Why is carrier design important for precision finishing?General reference — not yet source-verified

Carrier geometry and material affect how the part is supported, how evenly it moves through the abrasive field, and how well it resists chipping, distortion, or uneven removal. For delicate or high-precision parts, carrier selection is a major process variable.

What types of parts are typically run in lapping carriers?General reference — not yet source-verified

Typical parts include thin disks, wafers, optical components, ceramic pieces, and other flat parts that require controlled thickness, parallelism, and surface refinement during abrasive finishing.

Not publicly documented

The following facts about the 32T are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 32T are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 32T are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 32T are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 32T are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 32T is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 16, 2026.

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