SCREEN
FC 821 L
Wafer size
Wafer Transfer Machine
Power
3 φ 200 V, 125 A[1]
Vacuum
Exhaust Box[1]
Gas delivery
Chemical Bath (2)[1]
What is it?
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
- Exhaust Box[1]
Wafer handling2
- Carrier Transfer Robot[1]
Gas & chemistry2
Configuration & options9
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the FC 821 L are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC 821 L are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FC 821 L are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FC 821 L are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC 821 L are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FC 821 L is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
- [3]Equipment inventory listing
Last updated Jul 29, 2026.
