SST 201 SRD

The Semitool SST 201 SRD belongs to the wet bench and single-substrate or batch wet clean class used in semiconductor and related microfabrication lines. Machines of this class handle wafers or similar substrates with liquid chemistries and purified rinse media to remove particles, residues, films, or reaction byproducts without using dry plasma-based methods.

Machines of this class move substrates through controlled wet steps that can include chemical dispense or immersion, rinse, and final dry. The process sequence is designed to expose the surface to selected liquids for contaminant removal or neutralization, then replace those liquids with high-purity rinse media so that dissolved material and loose particles are carried away from the substrate.

Drying in this class commonly relies on controlled fluid removal and surface tension management so that the substrate exits with minimal watermarking or residue. Such systems typically combine chemical delivery, recirculation or drain handling, substrate handling, enclosure-based contamination control, and recipe-driven process timing to maintain repeatable surface condition from lot to lot.

Machines of this class are generally used for post-etch cleaning, resist-related residue removal, pre-deposition surface preparation, post-plating rinsing, oxide or native film preparation steps, and final rinse-dry sequences for substrates that require a clean, uniform surface. Similar tools are also used in compound semiconductor, microelectromechanical, wafer-level packaging, and precision substrate cleaning workflows where wet chemistry is the preferred treatment method.