Waferpedia

SVG

88

Thermal / DiffusionSVG 88 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The SVG 88 is a coater system. The SVG 88 supports 6-inch and 8-inch wafer sizes. The SVG 88 uses a single-track configuration with sender indexer, coat-bake-receiver indexer.[1]

SVG88
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What it is

The SVG 88 is a photoresist coating system used in semiconductor manufacturing to apply a uniform layer of photoresist onto wafers. The SVG 88 is a coater, not a developer or scrubber. The system supports 6-inch and 8-inch wafer sizes. The SVG 88 is configured as a single-track system with a sender indexer, a coat module, bake modules, and a receiver indexer (coat-bake-receiver indexer).[1][2]

What do the numbers mean?

Wafer handling7

Sender indexer
coat-bake-receiver indexer[1]
Accurate?
Wafer sizes
6 inch, 8 inch[1]
Accurate?
Included modules
Sender indexer, coat module, bake module, receiver indexer[1]
Accurate?
Substrate support
SiC, Sapphire, Quartz, Ge, GaAs, GaN[2]
Accurate?
Dual wafer size upgrade
Supported[2]
Accurate?
Wafer Sizes
6, 8 inch[1]
Accurate?
Indexer arrangement
Sender indexer: coat-bake-receiver indexer[1]
Accurate?

Configuration & options4

Single track[1]
Accurate?
Track configuration
Single track[1]
Accurate?
Make
SVG[1]
Accurate?
Model
88[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
SVG 88e———shellbacksemi.com[2]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

How is diffusion processing different from deposition or etch?General reference — not yet source-verified

Diffusion and other thermal treatments rely primarily on temperature and atmosphere to change the wafer, rather than adding a patterned layer or removing material selectively. The purpose is often to modify the existing material system, such as moving dopants, repairing lattice damage, or changing film properties.

Why is ambient control important in this class of machine?General reference — not yet source-verified

The gas environment influences reaction chemistry, contamination risk, and the final electrical or physical properties of the wafer. Precise control of oxidizing, inert, or other process atmospheres helps ensure repeatable results and protects the wafer from unintended reactions.

Not publicly documented

The following facts about the 88 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 88 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 88 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 88 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 88 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 88 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]shellbacksemi.com — shellbacksemi.comshellbacksemi.com
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Last updated Oct 16, 2026.

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