YES
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The process sequence described for BCB adhesion uses an adhesion promoter on the substrate surface, followed by spin drying and immediate BCB coating.[1]
The adhesion promoter layer is thin, and its thickness can vary with spin speed and bake temperature while adhesion remains largely independent of that thickness.[1]
The BCB adhesion flow described for this class includes surface pre-clean, adhesion promoter application, optional bake, BCB coating, and subsequent evaluation of adhesion and chemical durability.[1]
The YES 166 is applicable to adhesion promotion for BCB films on silicon and other substrate surfaces used in semiconductor devices and packages.[1]
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The substrate surface is first treated with an adhesion promoter and then spun dry before BCB coating.[1]
AP3000 and AP8000 are the only adhesion promoters recommended for use with BCB.[1]
Vapor priming of AP3000 and AP8000 is not recommended.[1]
An oxygen plasma pre-clean, with or without a water rinse, is the most generally applicable procedure.[1]
The following facts about the 166 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 166 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 166 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 166 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 166 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 166 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 20, 2026.