Fab Operation
Qubits, JJs, cryo-electronics
Superconducting and quantum device fabrication: ultra-clean deposition, fine-line patterning, and low-damage etch.
Lithography
E-beam or high-NA optical; overlay budget is the pairing concern
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
The KLA FT-750 is a visible light spectrophotometer-based thin film measurement system for semiconductor process control.
The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.
The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.
Spin coater
E-beam or high-NA optical; overlay budget is the pairing concern
The Laurell EDC-HL-15 B is a 650-series EDC spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.
The Laurell EDC-HL-23 B is a compact EDC spin processor with capacity for up to 150 mm wafers and 5 in x 5 in substrates.
The Laurell EDC-HL-8 B is a compact EDC spin processor that accommodates up to 200 mm wafers and 7 in × 7 in substrates.
The Laurell H6-23 is a compact HL Series spin coater for wafers and substrates, with a maximum rotational speed of 12,000 RPM.
The Laurell WS-650-8B is a compact 650-series spin coater with a maximum rotational speed of 12,000 RPM and support for wafers up to 200 mm.
Deposition
Base-pressure and interface quality dominate qubit coherence
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.
The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.
The Applied Materials Producer III is a chemical vapor deposition (CVD) system.
Etch
The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.
The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.
The Tel Unity M 8555 DDD is an etcher from Tokyo Electron.
Lam Research A 6 Exelan HPT is a dielectric etch tool configured for 8-inch wafers and identified with Exelan HPT chambers.
The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.
Wet Processing / Clean
Interface residues are a leading coherence killer
Tokyo Electron Clean Track Act 8 is a DUV clean track system for 8-inch wafers.
The Semitool 270 S L SRD is an automated spin rinse dryer used in semiconductor wafer processing.
ASML SERV.470.54502 is a sealed cleanroom part designated as an OIU Trackball Assembly.
The SCREEN / DNS 80 EX Wafer Scrubber is a wafer scrubber with 4 cleaning units, brush cleaning, and CO2 high-pressure washing.
Test & Probe
Room-temperature screening before cooldown saves cryostat time
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The ESPEC 212M is an environmental test chamber model documented in two user manuals on MetrologyManuals.
The Rasco SO 2000 Handler is a dual-temp tube-to-tube handler for SSOP 8 and 16 packages with 4 sites.
Metrology & Inspection
Room-temperature screening before cooldown saves cryostat time
The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.
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