Fab Operation
Co-packaged optics, optical I/O
Silicon photonics and co-packaged optics: high-precision assembly, wafer-level optical test, and advanced packaging integration.
Lithography
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
The KLA FT-750 is a visible light spectrophotometer-based thin film measurement system for semiconductor process control.
The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.
The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.
Etch
Litho and etch travel together for waveguide definition
The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.
The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.
The Tel Unity M 8555 DDD is an etcher from Tokyo Electron.
Lam Research A 6 Exelan HPT is a dielectric etch tool configured for 8-inch wafers and identified with Exelan HPT chambers.
The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.
Deposition
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.
The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.
The Applied Materials Producer III is a chemical vapor deposition (CVD) system.
Packaging & Bonding
Sub-micron placement pairs with active optical alignment
MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.
The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.
The K&S 4524 D is a Digital Series manual wire bonder.
The ESEC ESEC_2100HS is an automatic epoxy die bonder. The ESEC ESEC_2100HS appears in the category of semiconductor assembly die bonders.
The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.
Assembly / SMT
Sub-micron placement pairs with active optical alignment
The DEK 288 is a screen printer for printed circuit boards, supporting board sizes up to 510x510 mm with vision alignment accuracy of 25 µm.
Juki IFS NX Programming Station is a programming station that includes a Juki Feeder Setup Jig.
The Electrovert Vectra Wave Soldering Machine is a lead-free, nitrogen-capable wave soldering system with a maximum PCB conveyor width of 18 inches (457 mm).
The Panasonic W 2 is a pick and place machine used for surface-mount technology (SMT) assembly.
Test & Probe
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The ESPEC 212M is an environmental test chamber model documented in two user manuals on MetrologyManuals.
The Rasco SO 2000 Handler is a dual-temp tube-to-tube handler for SSOP 8 and 16 packages with 4 sites.
Metrology & Inspection
The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.
Dicing & Grinding
The Buehler Isomet 4000 is a precision linear sectioning saw.
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.
The Accretech ACS 100 A is a cleaning after dicer system used in semiconductor dicing and grinding operations.
The Disco DAD 3350 is an automatic dicing saw.
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