Power Devices

The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.

The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.

The SUSS ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists.

The Varian 350D is a medium current ion implanter that was the tool of choice for semiconductor doping in the early 1980s.

The Applied Materials / Varian VIISta HC Ion Implant is an ion implantation system.

The Varian Viision 200 is an ion implanter for 8-inch wafers.

The Varian Kestrel 750 is an ion implanter that handles 200 mm wafers and is classified as a MEV Implanter.

The Axcelis NV GSD HE is an ion implantation system that can handle 6-inch and 8-inch wafers.

The Samsung Galaxy S 4G is a smartphone released in February 2011 with a 4.0-inch Super AMOLED display, 1 GHz Hummingbird processor, and 5 MP camera.

The BTU Pyramax 98 is a forced convection lead-free reflow oven with up to 7 heated zones and a 350°C maximum operating temperature.

The SPTS CET25 is a 25-wafer batch process module for HF vapor release etch for MEMS.

The Oxford NGP80 RIE is a plasma etch system located in room W1-062.

The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.

The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.

The Denton Vacuum EE-4 is an electron beam deposition tool with a 6-position hearth, a dual chamber design, automated pump-down/venting, and capacity for multiple wafer sizes.

The SPTS MVD100E is a Molecular Vapor Deposition system designated for R&D or pilot manufacturing.

The Oxford 100 Plus Nitride is a nitride deposition system made by Oxford.

The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.

The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.

The Disco DAD641 is an automatic dicing saw used for wafer dicing operations.

The Disco DAD3241 is a high-productivity automatic dicing saw that supports large workpieces up to Φ8”.

The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.

The DEK 288 is a screen printer for printed circuit boards, supporting board sizes up to 510x510 mm with vision alignment accuracy of 25 µm.

Juki IFS NX Programming Station is a programming station that includes a Juki Feeder Setup Jig.

Panasonic CM 602 Pick and Place Machine Nozzles are nozzles designed for use with the Panasonic CM 602 pick and place machine.

The Mycronic / Mydata MY 12 E is a pick and place machine for SMT assembly.

The Disco DFL7340 is a stealth dicing system used for silicon wafer dicing.

The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.

The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.

The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.

The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.

The KLA 1007 is a wafer prober manufactured by KLA.

The Cascade Microtech 103-754 is an x-y-z-θ probe positioner used in the HFTL 50-GHz Small-Signal Probe Station.

The Electroglas 2001 CX Automatic Wafer Prober is an automatic wafer prober designed for wafer test and sort.