Fab Operation
Integrated photonics, waveguides, lasers on chip
Photonic integrated circuit fabrication: waveguide patterning, cladding deposition, facet preparation, and optical test.
Lithography
Pairs with the resist coat/develop track
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
The KLA FT-750 is a visible light spectrophotometer-based thin film measurement system for semiconductor process control.
The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.
The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.
Spin coater
Pairs with the resist coat/develop track
The Laurell EDC-HL-15 B is a 650-series EDC spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.
The Laurell EDC-HL-23 B is a compact EDC spin processor with capacity for up to 150 mm wafers and 5 in x 5 in substrates.
The Laurell EDC-HL-8 B is a compact EDC spin processor that accommodates up to 200 mm wafers and 7 in × 7 in substrates.
The Laurell H6-23 is a compact HL Series spin coater for wafers and substrates, with a maximum rotational speed of 12,000 RPM.
The Laurell WS-650-8B is a compact 650-series spin coater with a maximum rotational speed of 12,000 RPM and support for wafers up to 200 mm.
Etch
Sidewall roughness drives optical loss — pair with post-etch metrology
The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.
The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.
The Tel Unity M 8555 DDD is an etcher from Tokyo Electron.
Lam Research A 6 Exelan HPT is a dielectric etch tool configured for 8-inch wafers and identified with Exelan HPT chambers.
The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.
Deposition
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.
The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.
The Applied Materials Producer III is a chemical vapor deposition (CVD) system.
Thermal / Diffusion
Anneal steps densify deposited cladding
The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.
The Tokyo Electron A 8 S ZA is a PoCl3 furnace with an EPROM based control system.
The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.
The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.
The Samsung Galaxy S 4G is a smartphone released in February 2011 with a 4.0-inch Super AMOLED display, 1 GHz Hummingbird processor, and 5 MP camera.
Precision Optics
The Wyko HD8000 is a non-contact optical profiler for magnetic thin-film heads that measures pole-tip recession or ABS flatness in less than 3 seconds.
The Nikon Z series is a line of mirrorless interchangeable-lens cameras using the Nikon Z-mount with FX and DX sensors.
The Nikon 150 X Objectives is a microscope objective used in optical spectroscopy and nanoribbon characterization.
The Keysight 5517A is a Class II helium-neon laser source providing stable 633 nm wavelength light for precision dual-frequency interferometry.
The Zygo Zegage 3D Optical Surface Profiler is a non-contact optical profiler for measuring surface topography.
Dicing & Grinding
Dicing quality sets facet coupling loss
The Buehler Isomet 4000 is a precision linear sectioning saw.
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.
The Accretech ACS 100 A is a cleaning after dicer system used in semiconductor dicing and grinding operations.
The Disco DAD 3350 is an automatic dicing saw.
Wet Processing / Clean
Between every patterning and deposition pass
Tokyo Electron Clean Track Act 8 is a DUV clean track system for 8-inch wafers.
The Semitool 270 S L SRD is an automated spin rinse dryer used in semiconductor wafer processing.
ASML SERV.470.54502 is a sealed cleanroom part designated as an OIU Trackball Assembly.
The SCREEN / DNS 80 EX Wafer Scrubber is a wafer scrubber with 4 cleaning units, brush cleaning, and CO2 high-pressure washing.
Test & Probe
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The ESPEC 212M is an environmental test chamber model documented in two user manuals on MetrologyManuals.
The Rasco SO 2000 Handler is a dual-temp tube-to-tube handler for SSOP 8 and 16 packages with 4 sites.
Metrology & Inspection
Film-thickness and CD checks close the loop on litho and etch
The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.
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