Fab Operation
Integrated photonics, waveguides, lasers on chip
Photonic integrated circuit fabrication: waveguide patterning, cladding deposition, facet preparation, and optical test.
Spin coater
Resist coat ahead of exposure
The Laurell WS-650-23 is a station-mounted spin coater in the WS-650 series that accommodates up to ø 150 mm wafers and 5" × 5" substrates.
The Laurell EDC-HL-15 B is a 650-series EDC spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.
The Laurell EDC-HL-23 B is a compact EDC spin processor with capacity for up to 150 mm wafers and 5 in x 5 in substrates.
The Laurell H6-23 is a compact HL Series spin coater for wafers and substrates, with a maximum rotational speed of 12,000 RPM.
The Laurell WS-650-8B is a compact 650-series spin coater with a maximum rotational speed of 12,000 RPM and support for wafers up to 200 mm.
Lithography
Pairs with the resist coat/develop track
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.
The SUSS ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists.
Etch
Sidewall roughness drives optical loss — pair with post-etch metrology
The SPTS CET25 is a 25-wafer batch process module for HF vapor release etch for MEMS.
The Oxford NGP80 RIE is a plasma etch system located in room W1-062.
The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.
The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.
Deposition
The Denton Vacuum EE-4 is an electron beam deposition tool with a 6-position hearth, a dual chamber design, automated pump-down/venting, and capacity for multiple wafer sizes.
The SPTS MVD100E is a Molecular Vapor Deposition system designated for R&D or pilot manufacturing.
The Oxford 100 Plus Nitride is a nitride deposition system made by Oxford.
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
Thermal / Diffusion
Anneal steps densify deposited cladding
The Samsung Galaxy S 4G is a smartphone released in February 2011 with a 4.0-inch Super AMOLED display, 1 GHz Hummingbird processor, and 5 MP camera.
The BTU Pyramax 98 is a forced convection lead-free reflow oven with up to 7 heated zones and a 350°C maximum operating temperature.
Precision Optics
The SCIEX API 3000 is a triple quadrupole LC/MS/MS mass spectrometer used for analytical applications such as protein and peptide analysis, small molecule drug metabolism studies, and pharmacokinetic screening.
The Bruker Contour R1 is a 3D optical metrology system used for non-contact surface characterization.
The SCIEX API 2000 is a compact triple-quadrupole LC/MS/MS system introduced in 1998.
The Perkin Elmer 1050 UV-VIS Spectrometer is an instrument used for analyzing ultraviolet and visible light absorption spectra.
The Zygo Zegage 3D Optical Surface Profiler is a non-contact optical profiler for measuring surface topography.
Dicing & Grinding
Dicing quality sets facet coupling loss
The Disco DAD641 is an automatic dicing saw used for wafer dicing operations.
The Disco DAD3241 is a high-productivity automatic dicing saw that supports large workpieces up to Φ8”.
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
Wet Processing / Clean
Between every patterning and deposition pass
The EVG 301 is a semi-automated single wafer cleaning system for R&D, featuring megasonic cleaning, spinner rotation up to 3000 rpm, and optional pre-bonding and IR-inspection modules.
The DISCO DCS1460 is an automatic cleaning system for Φ300 mm wafers used to clean workpieces that have been cut on a dicing saw.
The Ultratech 602 Plate Mask Cleaner is a cleaning tool designed for masks and plates in semiconductor manufacturing.
The Tokyo Electron Clean Track Lithius Pro V is a resist coater/developer for 12-inch wafers, described as a multi-block system.
Test & Probe
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The KLA 1007 is a wafer prober manufactured by KLA.
The Cascade Microtech 103-754 is an x-y-z-θ probe positioner used in the HFTL 50-GHz Small-Signal Probe Station.
The Electroglas 2001 CX Automatic Wafer Prober is an automatic wafer prober designed for wafer test and sort.
Metrology & Inspection
Film-thickness and CD checks close the loop on litho and etch
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
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