Fab Operation
AI accelerator BEOL, HBM stacks, CoWoS interposers
Advanced packaging and back-end-of-line fabrication for AI accelerators, high-bandwidth memory, and 2.5D silicon interposers: bonding, thinning, TSV processing, CMP, and high-speed test.
Lithography
Fine-line RDL and via patterning — overlay budget is critical at advanced nodes
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.
The SUSS ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists.
Spin coater
Resist coat ahead of exposure
The Laurell WS-650-23 is a station-mounted spin coater in the WS-650 series that accommodates up to ø 150 mm wafers and 5" × 5" substrates.
The Laurell EDC-HL-15 B is a 650-series EDC spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.
The Laurell EDC-HL-23 B is a compact EDC spin processor with capacity for up to 150 mm wafers and 5 in x 5 in substrates.
The Laurell H6-23 is a compact HL Series spin coater for wafers and substrates, with a maximum rotational speed of 12,000 RPM.
The Laurell WS-650-8B is a compact 650-series spin coater with a maximum rotational speed of 12,000 RPM and support for wafers up to 200 mm.
Etch
Deep silicon etch for TSVs in HBM; aspect ratios >10:1 demand DRIE
The SPTS CET25 is a 25-wafer batch process module for HF vapor release etch for MEMS.
The Oxford NGP80 RIE is a plasma etch system located in room W1-062.
The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.
The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.
Thermal / Diffusion
Anneal steps for barrier densification and stress relief
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The BTU Pyramax 98 is a forced convection lead-free reflow oven with up to 7 heated zones and a 350°C maximum operating temperature.
Deposition
ALD for TSV barrier/seed layers; PECVD for ILD; CVD for passivation
The Denton Vacuum EE-4 is an electron beam deposition tool with a 6-position hearth, a dual chamber design, automated pump-down/venting, and capacity for multiple wafer sizes.
The SPTS MVD100E is a Molecular Vapor Deposition system designated for R&D or pilot manufacturing.
The Oxford 100 Plus Nitride is a nitride deposition system made by Oxford.
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
CMP
TSV reveal CMP pairs with thinning; ILD polish after each metal level
The Strasbaugh 6 AI-DC 6 is a polisher.
The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing.
Packaging & Bonding
Thermocompression and hybrid bonding for HBM stacking and CoWoS integration
The Disco DFL7340 is a stealth dicing system used for silicon wafer dicing.
The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.
The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.
The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.
Dicing & Grinding
Backgrind to expose TSVs; thin-wafer handling is the pairing concern
The Disco DAD641 is an automatic dicing saw used for wafer dicing operations.
The Disco DAD3241 is a high-productivity automatic dicing saw that supports large workpieces up to Φ8”.
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
Test & Probe
High-speed ATE for HBM characterisation and AI SOC final test
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The KLA 1007 is a wafer prober manufactured by KLA.
The Cascade Microtech 103-754 is an x-y-z-θ probe positioner used in the HFTL 50-GHz Small-Signal Probe Station.
The Electroglas 2001 CX Automatic Wafer Prober is an automatic wafer prober designed for wafer test and sort.
Metrology & Inspection
Overlay, bond-void, and bump-height metrology gate every packaging step
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
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